| 发明名称 |
Improvements in or relating to solders |
| 摘要 |
<p>A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.</p> |
| 申请公布号 |
GB2406101(B) |
申请公布日期 |
2006.08.02 |
| 申请号 |
GB20040023860 |
申请日期 |
2004.10.27 |
| 申请人 |
QUANTUM CHEMICAL TECHNOLOGIES;SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE LTD |
发明人 |
KAIHWA CHEW;BRANDAN KU;VINCENT YUE SERN KHO |
| 分类号 |
B23K35/26 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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