Connecting method of resin material molded product, process cartridge and assembling method of process cartridge

摘要

A bonding method for bonding molded resin products, the improvement residing in that a first one (51) of the molded resin products and a second one (51) of the molded resin products are bonded by injecting resin material through a resin material injection path (200) to a bonding portion (154a) therebetween, wherein the resin material injection path is formed in one of or both of the first resin material molded product and the second resin material molded product.