| 摘要 |
An IC socket includes an insulative housing having an IC package receiving recess, in which an IC package is received. Contacts are disposed within cavities, which are provided in the IC package receiving recess in a matrix arrangement. Each contact includes a base which is installed into a cavity, an upwardly extending contact arm, which is offset above a cavity and a downwardly extending terminal portion, for electrically connecting with a circuit board. The insulative housing includes first partition walls which are provided between rows of cavities adjacent to each other in the first direction and second partition walls which are provided between rows of cavities adjacent to each other in a second direction perpendicular to the first direction, the first partition walls having greater heights than those of the second partition walls.
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