发明名称 A LASER CUTTING APPARATUS AND A METHOD OF CUTTING A GLASS SUBSTRATE THEREBY
摘要 <p>Laser cutting device for cutting a glass substrate of a liquid crystal display, and methods for cutting a glass substrate using that device. The device includes a vacuum chuck rotatably mounted for securing bonded first and second substrates, a rotating member for rotating the vacuum chuck, and a laser for directing a laser beam onto the first and second substrates into cut the substrates held by the vacuum chuck.</p>
申请公布号 KR100606955(B1) 申请公布日期 2006.07.31
申请号 KR19990040645 申请日期 1999.09.21
申请人 发明人
分类号 B23K26/00;B23K26/08;B23K26/16;B23K26/36;B23K26/40;C03B33/03;C03B33/07;C03B33/09;G02F1/1333 主分类号 B23K26/00
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