| 摘要 |
A jig for heat treating a semiconductor substrate having a split structure of a first jig composed of a silicon material and supporting the semiconductor substrate by touching it directly, and a second jig (holder) for holding and mounting the first jig on a heat treatment boat, wherein deformation of the jig can be reduced by optimizing the jig material and specifying the surface roughness and surface flatness thereby suppressing concentration of stress to a specific position of the semiconductor substrate during heat treatment. Since occurrence of slip can be prevented effectively even when a semiconductor wafer having a large self-weight stress is heat treated or when heat treatment is performed under conditions of large thermal stress, the jig is applicable widely to stabilized heat treatment of a semiconductor substrate.
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