| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi layer wiring board that enables wiring conductors to be mounted and wired on the multi-layer wiring board with a high reliability and enables the wiring conductor layers to be formed in narrow pitch. SOLUTION: In this multi layer wiring board, multiple insulated layers 2, each of which laminates an insulator film layer 4 and an insulated adhesive agent layer 5, and multiple wiring conductor layers 3 are laminated alternately, and each insulated layer 2 is provided with an unformed part 8 of the insulated adhesive agent layer 5. COPYRIGHT: (C)2006,JPO&NCIPI |
