发明名称 Methods of forming a semiconductor device having a metal gate electrode and associated devices
摘要 Methods of forming a semiconductor device having a metal gate electrode include sequentially forming a gate insulator, a gate polysilicon layer and a metal-gate layer on a semiconductor substrate. The metal-gate layer and the gate polysilicon layer are sequentially patterned to form a gate pattern comprising a stacked gate polysilicon pattern and a metal-gate pattern. An oxidation barrier layer is formed to cover at least a portion of a sidewall of the metal-gate pattern.
申请公布号 US2006163677(A1) 申请公布日期 2006.07.27
申请号 US20060386644 申请日期 2006.03.22
申请人 SAMSUNG ELECTRONIC CO., LTD. 发明人 HEO SEONG-JUN;YOUN SUN-PIL;KIM SUNG-MAN;CHOI SI-YOUNG;CHOI GIL-HEYUN;KU JA-HUM;LEE CHANG-WON;LEE JONG-MYEONG;RYU KWON-SUN
分类号 H01L21/336;H01L29/94;H01L21/28;H01L29/49;H01L29/78 主分类号 H01L21/336
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