| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board, which can stably operate electronic components, such as a semiconductor element mounted thereon, without lowering the mechanical strength of a ceramic substrate by preventing a crack generation of the ceramic substrate, when connecting a signal terminal to the ceramic circuit board, and moreover having a high bonding strength between a metal circuit plate and signal terminal. SOLUTION: In the ceramic circuit board, the signal terminal 3 is installed on the surface of the metal circuit plate 2 connected with the ceramic substrate 1, by melting each surface by ultrasonic welding method. The board is provided a connecting part, in which the metal circuit plate 2 and signal terminal 3 are connected in the outside region of a melting portion 4 of the metal circuit plate 2 and signal terminal 3 in planar view, and the connecting part surrounds the melting portion 4 in the planar view. COPYRIGHT: (C)2006,JPO&NCIPI
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