| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of fabricating a printed circuit board excellent in an adhesive strength between a surface-layer conductor layer and a surface-layer insulating layer as well as extremely small in a surface roughness of the surface-layer insulating layer, and also suitable for formation of a fine circuit. SOLUTION: In the method of fabricating a printed circuit board through removing a surface-layer metal foil of a metal-foil-clad laminated plate and forming a conductor layer on a surface-layer insulating layer by plating, the metal-foil-clad laminated plate is a metal-foil-clad laminated plate that has a block copolymer polyimide resin layer arranged in contact with the surface-layer metal foil. COPYRIGHT: (C)2006,JPO&NCIPI
|
