| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition exhibiting good adhesion to an Ni-Pb lead frame even in a moisture-absorbed state; and to provide a semiconductor device having excellent reliability such as solder crack resistance by using the resin composition as a die-attaching material for the semiconductor. SOLUTION: The resin composition for sticking the semiconductor device consists essentially of (A) a silver powder, (B) a compound having a glycidyl group, and (C) a compound having at least two hydroxy groups on the same aromatic ring. The semiconductor device is obtained by using the resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
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