NOVEL POLYIMIDE FILM WITH IMPROVED ADHESIVENESS

摘要

Disclosed is a polyimide film which exhibits high adhesion to a metal foil via an adhesive layer containing a thermoplastic polyimide without requiring a special surface treatment. Specifically disclosed is a non-thermoplastic polyimide film obtained by imidating a polyamide acid solution which is obtained from an aromatic diamine and an aromatic acid dianhydride. This non-thermoplastic polyimide film is characterized in that the aromatic diamine contains 4,4'-diaminodiphenyl ether and bis{4-(4-aminophenoxy)phenyl}propane, and the solution containing a polyamide acid is obtained by a specific production method.