| 摘要 |
<P>PROBLEM TO BE SOLVED: To maintain balance in stress in a semiconductor device in which two or more semiconductor elements are provided between both opposite metal bodies and the elements are molded by a resin. <P>SOLUTION: The semiconductor device 100 is provided with a first metal body 20 and a second metal body 30 which are oppositely provided; a first semiconductor element 10 provided between both the metal bodies 20, 30 and thermally connected to both the metal bodies 20, 30; a second semiconductor element 11 provided between both the metal bodies 20, 30 and thermally connected to both the metal bodies 20, 30; and a molding resin 70 filled between both the metal objects 20, 30, and sealing the first semiconductor element 10 and the second semiconductor element 11. In this semiconductor device 100, the first semiconductor element 10 is arranged at a position closer to the first metal body 20 and the second semiconductor element 11 is arranged at a position closer to the second metal body 30, in the center of a distance between both the metal bodies 20, 30 in a direction where both the metal bodies 20, 30 are spaced. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
