| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus having a plurality of high reliability ball-like conductive terminals where specifies of electronic devices, etc. mounted on a device substrate do not limit working conditions such as temperature, air pressure, etc. concerning the electronic forming. SOLUTION: A device substrate 4 is prepared with an electronic device, etc. 5 and pad electrodes 6 mounted thereon. Via-holes 3 are formed in a first support substrate 1 made of glass, etc., but not the device substrate 4, and the first support substrate 1 is adhered to the surface of the device substrate 4 with the bottom of the via-holes 3 laid on the surface of the pad electrodes 6. Through-electrodes 8 formed on the side wall of the via-hole 3 each, and conductive electrodes 11 electrically connected to the through-electrodes 8 are formed on the surface of the first support substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
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