| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer provided with TEG wherein the TEG can be arranged to obtain more semiconductor chips and the formed TEG can be efficiently removed. SOLUTION: The semiconductor wafer is provided with semiconductor elements arranged in a plurality of element formation areas, and TEGs arranged in the division areas partitioning the respective element formation areas. In this case, a TEG arrangement section with a partially enlarged width is formed in the division areas. Furthermore, a protective sheet is adhered to the semiconductor wafer, and the semiconductor wafer is etched by plasma to divide the respective element formation areas into pieces, so as to form semiconductor chips. Then, the protective tape is peeled off, and the TEGs which are left in the division areas and are still being adhered to the protective tape are removed together with the protective tape, as a result. COPYRIGHT: (C)2006,JPO&NCIPI |
