| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, having excellent reliability such as flame resistance, moldability, reflow resistance, moisture resistance, and characteristics after being left at high temperature, and suitable for sealing VLSI (Very Large Scale Integration); and to provide an electronic part device having an element sealed with the composition. SOLUTION: The epoxy resin composition for sealing contains (A) an epoxy resin, (B) a curing agent, (C) a cyclic phosphazene compound and (D) a styrenic rubber. COPYRIGHT: (C)2006,JPO&NCIPI
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