| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction electrode having both of solder junction reliability and improved gold wire-bonding properties inexpensively, and to provide a reliable and low-cost electronic component manufactured using a method for manufacturing the junction electrode. SOLUTION: The electronic component having the external junction electrode comprises a ceramic base; an external connection electrode section formed on the ceramic base; an underlayer made of a metal film mainly comprising nickel or a nickel alloy formed on the surface of the external connection electrode section; an intermediate layer comprising palladium or a palladium alloy formed on the surface of the underlayer; and a surface covering layer comprising gold or a gold alloy formed on the surface of the intermediate layer. COPYRIGHT: (C)2006,JPO&NCIPI
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