Device comprising cooler, supporting electronic component, and spring clip for pressing component against cooler for connection of component waste heat between component and cooler,

摘要

Cooling device incorporates cooler (1), on which is fitted electronic component (2), and spring clip (3) for pressing component onto cooler. Spring clip forms extra cooler and is of material, whose thermal conductivity exceeds that of electronic component, typically higher than spring steel.Spring clip thermal conductivity is specified and spring clip may be of spring bronze (SnCu6), aluminium, copper, brass, or their alloys.