| 摘要 |
PROBLEM TO BE SOLVED: To simplify a manufacturing process by optimizing a multi-layer metal structure of a wiring pattern and by forming the wiring pattern of main metal and sub-metal by liquid processing such as ink-jet coating. SOLUTION: A pixel section 300 is arranged in a matrix shape to comprise; a gate electrode 11 and a scanning wiring line 101 of only main metal, which are formed on an insulating substrate 51; a gate insulating film 53 formed on them; a data wiring line 201 of only main metal which is orthogonal to the scanning line and which is connected to a source electrode 12 of only main metal; a drain electrode 13 of main metal; semiconductor layers 54 and 55 which are respectively connected to the source electrode and the drain electrode; a cap metal 67 of sub-metal formed on the drain electrode; and a pixel electrode 21 which is connected to the cap metal via a contact hole 59. COPYRIGHT: (C)2006,JPO&NCIPI |
