发明名称 |
Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization |
摘要 |
A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishing even though the slurry has low solids-content. The slurry comprises a bicarbonate salt, which acts as a catalyst for increasing removal rates of dielectric films during polishing of these substrates.
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申请公布号 |
US2006162261(A1) |
申请公布日期 |
2006.07.27 |
申请号 |
US20050233110 |
申请日期 |
2005.09.22 |
申请人 |
SIDDIQUI JUNAID A;CASTILLO DANIEL H II;RICHARDS ROBIN E;COMPTON TIMOTHY F |
发明人 |
SIDDIQUI JUNAID A.;CASTILLO DANIEL H.II;RICHARDS ROBIN E.;COMPTON TIMOTHY F. |
分类号 |
C09K3/14;B24D3/02;H01L21/302 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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