Electronic component, circuit board, electronic apparatus, and method for manufacturing the electronic component

摘要

An electronic component (1) includes: a semiconductor substrate (10) having a first surface (10A) and a second surface (10B) opposing to the first surface (10A); a trans-substrate conductive plug (12) that penetrates the semiconductor substrate (10) from the first surface (10A) to the second surface (10B); an electronic element (50) provided in the vicinity of the first surface (10A) of the semiconductor; and a sealing member (40) that seals the electronic element (50) between the sealing member (40) and the first surface (10A), wherein the electronic element (50) is electrically connected to the trans-substrate conductive plug (12). The electronic element includes a surface acoustic wave device.