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发明名称
BONDED WAFER PRODUCING METHOD
摘要
申请公布号
EP1170801(B1)
申请公布日期
2006.07.26
申请号
EP20000963000
申请日期
2000.09.29
申请人
SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人
NAKANO, MASATAKE;MITANI, KIYOSHI;TOMIZAWA, SHINICHI
分类号
H01L27/12;H01L21/762
主分类号
H01L27/12
代理机构
代理人
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地址
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