| 摘要 |
PROBLEM TO BE SOLVED: To realize a bump producing method, capable of stably forming bumps without using a flux and forming highly reliable bumps. SOLUTION: A solder film 56, having a prescribed shape and connected to an electrode pad 52 on a semiconductor substrate 51 via a BLM film 54 is formed by using solder film formation, based on a vacuum evaporation method and the lifting-off of a resist pattern 55. After the surface treatment of the solder film 56 is executed, i.e., the removal of a natural oxide film and stuck matters on the surface and the activation of the surface by irradiating a wafer of the state with laser light, heat melting treatment for the film 56 is executed to form a solder ball bump 57. The heat melting treatment of the film 56 is executed in a vacuum nitrogen atmosphere or reducing gas atmosphere. |
