| 摘要 |
<p>A multilayer PCB includes a plurality of signal layers, a ground layer and a power layer disposed between the plurality of signal layers, a signal via extending through the plurality of signal layers to allow a signal current to flow therethrough, at least one stitching capacitor provided in one of the plurality of signal layers to allow a return current that corresponds to the signal current to flow between the power layer and the ground layer. Thus, the multiplayer PCB can form a path of a return current that minimizes generation of EMI when a signal current is generated.</p> |
