摘要 |
An water-based surface treatment agent used for the copper on a printed wiring board (PWB). Chemical layer formed on PWB shows excellent heat-resistance and moisture-resistance; therefore, the treated PWB preserve s excellent soldability for a long time. The water-based surface treatment agent contains, as an active ingredien t, a 2-arylimidazole compound represented by the following formula, (see formula I) wherein R is a hydrogen atom or a methyl group, R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, and R3 and R4 are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups, or (see formula II) wherein R is a hydrogen atom or a methyl group, and R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, but excluding the case the case where R, R1 and R2 are all hydrogen atoms.
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申请人 |
SHIKOKU CHEMICALS CORPORATION |
发明人 |
HIRAO, HIROHIKO;KIKUKAWA, YOSHIMASA;OKAMOTO, TOSHIHIRO;MURAI, TAKAYUKI;SOGABE, SEIJI;TANIOKA, MIYA;NAKAYAMA, RIE;YOSHIOKA, TAKASHI |