发明名称 |
Heatsink device and method |
摘要 |
A method and device for thermal conduction is provided. Devices and methods are shown that include the ability to dissipate increased amounts of heat due to the use of an active heat transfer device. Devices and methods are shown that share the necessary heat transfer between a passive heat transfer device and an active heat transfer device, thus increasing the amount of heat dissipated while maintaining reliability of the individual components. Devices and methods are shown that include an increased length of the heatsink which can keep large temperature differences between heat transfer structures and the heat transfer fluid such as air.
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申请公布号 |
US7082031(B2) |
申请公布日期 |
2006.07.25 |
申请号 |
US20030676230 |
申请日期 |
2003.09.30 |
申请人 |
INTEL CORPORATION |
发明人 |
LEIJA JAVIER;SAUCIUC IOAN;CHRYSLER GREGORY M. |
分类号 |
H05K7/20;H01L23/427;H01L23/467 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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