摘要 |
The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100 , the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111 A to 111 C, and opening a through hole 112 away from the electronic circuits 111 A to 111 C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112 , an electret member 130 laminated away from part of the electrode layer 120 and through hole 112 , and a diaphragm 140 provided with a spacing 160 to the electret member 130 , in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111 a of the electronic circuit 111 A through the case 200 (FIG. 6 ).
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