| 摘要 |
A heating and cooling appliance for use in a vehicle has an outer box, a thermal box, an inner box, at least one semiconductor chip and at least one heatsink assembly. The outer box is mounted in the vehicle to conform to interior equipment and furnishings of the vehicle and has a switch. The thermal box is mounted in the outer box and has multiple insulated walls and at least one heat-conducting wall. The inner box is mounted in the thermal box. The semiconductor chip is attached to the heat-conducting wall and connected electrically to the switch. The heatsink assembly is attached to the semiconductor chip and mounted securely on the thermal box. Changing the position of the switch will change the operating mode of the semiconductor chip to either heat or cool the heat-conducting wall and the contents of the inner box.
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