| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad which minimizes edge sagging of a wafer, reduces generation of unusual sound, vibration and damping, by suppressing the slidability of a polishing head, and is excellent in pad service life and polishing rate. <P>SOLUTION: The polishing pad 5 has a lamination structure consisting of a polishing layer 1 formed of a foamed polyurethane resin, an adhesive layer 3, a cushioning layer 2, and a tackifier layer 4 to be stuck to a polishing device surface plate, which are laminated on each other in this order. Herein, when the tackifier layer of the polishing pad is stuck to a non-repulsive board, a rebound resilience value of a front surface of the polishing layer measured according to JIS K6400, is set to 35 to 45%. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
