Method for determining surface of recesses arranged in carrier substrate involves baking carrier substrate in chamber and evacuating chamber, in order to produce and make around an essentially degassed total surface of carrier substrate

摘要

The method involves baking carrier substrate (2) in chamber (5) and evacuating chamber, in order to produce and make around complete surface of carrier substrate and chamber essentially degassed and make vacuum available in chamber. Given quantity of inert gas is supplied which exceeds total surface of chamber and carrier substrate, completely covering saturation quantity of gas. Pressure value of chamber is determined and on the basis of pressure value, surface of recesses (3) arranged in carrier substrate is assigned. An independent claim is also included for the application of the method.