CONTACT STRUCTURE FOR INSPECTION, AND PROBE CARD

摘要

Electrical characteristic inspection is stably performed to a wafer having electrodes at an extremely fine and narrow pitch. On a lower plane side of a circuit board in a probe card, a contact structure for inspection is attached. On the contact structure, sheets having elasticity and provided with protruding conductive parts are attached on the both sides of the silicon substrate. On the silicon substrate, a current carrying path penetrating in the vertical direction is formed, and each sheet conductive part is brought into contact with the current carrying path at the top and the bottom. The conductive part on the upper side is brought into contact with a connecting terminal of a circuit board. At the time of inspecting the electrical characteristics of the wafer, an electrode pad on the wafer is pressed by each conductive part on the lower side and brought into contact with the conductive part. Variance in electrode pad heights is absorbed by the lower side conductive part, distortion and warpage of the circuit board side are absorbed, and contact of the conductive part with the electrode pad is maintained.