发明名称 |
IC token, injection molding die for the IC token manufacturing method for the IC token and an IC token selection device |
摘要 |
An IC token for use in a machine such as a gaming device has an IC tag centrally located within a ring of electromagnet wave-absorbing material. The ring is designed to permit a peripheral attachment to the edges of the IC tag with appropriate molding dies to encapsulate the IC token in a resin. The IC token is adapted to be read by a selection device having an antenna along an inclined guide rail while eliminating the possibility of crosstalk between tokens.
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申请公布号 |
US2006160628(A1) |
申请公布日期 |
2006.07.20 |
申请号 |
US20050318670 |
申请日期 |
2005.12.27 |
申请人 |
ABE HIROSHI |
发明人 |
ABE HIROSHI |
分类号 |
A63F13/00;G06K19/073;G06K19/077 |
主分类号 |
A63F13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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