发明名称 IC token, injection molding die for the IC token manufacturing method for the IC token and an IC token selection device
摘要 An IC token for use in a machine such as a gaming device has an IC tag centrally located within a ring of electromagnet wave-absorbing material. The ring is designed to permit a peripheral attachment to the edges of the IC tag with appropriate molding dies to encapsulate the IC token in a resin. The IC token is adapted to be read by a selection device having an antenna along an inclined guide rail while eliminating the possibility of crosstalk between tokens.
申请公布号 US2006160628(A1) 申请公布日期 2006.07.20
申请号 US20050318670 申请日期 2005.12.27
申请人 ABE HIROSHI 发明人 ABE HIROSHI
分类号 A63F13/00;G06K19/073;G06K19/077 主分类号 A63F13/00
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