发明名称 CURABLE COMPOSITION
摘要 <p>A two component curable composition, characterized in that it comprises an A material containing (A) 100 parts by weight of an organic polymer having a reactive silicon group, (B) 0.1 to 300 parts by weight of a compound containing an epoxy group and (C) 0.1 to 20 parts by weight of water, and a B material containing (D) 0.1 to 20 parts by weight of a curing catalyst and (E) 0.1 to 200 parts by weight of an amine compound. The above two component curable composition has an A material being easy to handle, is excellent in curing characteristics of the internal portion thereof, and exhibits good storage stability.</p>
申请公布号 WO2006075482(A1) 申请公布日期 2006.07.20
申请号 WO2005JP23324 申请日期 2005.12.20
申请人 KANEKA CORPORATION;ANDO, KATSUHIRO 发明人 ANDO, KATSUHIRO
分类号 C08L63/00;C08G59/50;C08L33/00;C08L71/00;C09D163/00;C09J163/00;C09K3/10 主分类号 C08L63/00
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