| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface mounting LED using a resin substrate which is not cracked, damaged or waved even if mold clamping pressure of a mold is applied when an LED chip mounted on the resin substrate is resin sealed by transfer molding. <P>SOLUTION: A pair of circuit patterns 4a and 5a are formed at the opposite ends on the surface side of an insulating resin body 3, inner ends 4b and 5b of the circuit patterns 4a and 5a are formed arcuately, and a pair of circuit patterns 4c and 5c are extended inward to oppose each other from respective ends 4b and 5b. An LED chip 1 is mounted at the distal end of the circuit pattern 4c, upper electrode of the LED chip 1 is connected with an electrode pattern 5c through a bonding wire 6, and the LED chip 1 and the bonding wire 6 are sealed with translucent resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
