| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance reliability of electrical characteristics by suppressing interfacial exfoliation of a circuit pattern and a conductive adhesive in a surface mounting LED where an LED chip is mounted on the circuit pattern formed on the bottom face of a recess provided in a substrate through the conductive adhesive and then sealed with sealing resin. <P>SOLUTION: Circuit patterns 2a, 5a, 5b, 5c are formed partially on the bottom face 4 and the inner circumferential surface of a recess 3 provided in a substrate 10 and an LED chip 7 is mounted, and then the entirety is sealed with sealing resin such as translucent resin 9 to cover the LED chip 7. Since an insulator 1, i.e. the base material of a substrate exposed to a part where the circuit pattern is not formed, and the translucent resin 9 form an adhesion interface, adhesion strength is enhanced and interfacial exfoliation of the circuit patterns 2a, 5a and a conductive adhesive 6 can be suppressed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
