| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting apparatus capable of executing cutting operation smoothly and accurately without deposition of an adhesive, and a cutting method. SOLUTION: The cutting apparatus cuts off an adhesive sheet in the directions of its width and circumference for every semi-conductor wafer. The cutting apparatus includes a cutter unit having a cutter attached to its tip end. The cutter unit is attached to a bracket so as to rotate along a circular arc shape hole in an almost vertical plane, and is configured so as to cut off the adhesive sheet along the outside periphery of the semi-conductor wafer in the tilted state of a cutter blade. COPYRIGHT: (C)2006,JPO&NCIPI |
