| 摘要 |
<p>A high resolution and low-cost exposure method suitable for forming a fine pattern configuring an electronic device. A diffraction grating is arranged adjacent to a wafer, or the like, which configures the electronic device, and wafer exposure is performed by irradiating the wafer with illuminating light having a specific incidence angle characteristic to the diffraction grating. The exposure is performed by changing a positional relationship between the semiconductor wafer and the diffraction grating when required.</p> |
