METHOD FOR MANUFACTURING PROFILED CIRCUIT BOARDS

摘要

FIELD: tool-making industry, possible use in technology for manufacturing relief circuit boards. ^ SUBSTANCE: method uses filling of porous structure of substrate of circuit board by acryl polymers, while aforementioned filling is performed prior to performing operation of forming of metallic conductors in grooves. Method makes it possible to increase production of valid circuit boards, to increase resistance level of isolation between disconnected circuits and to realize technology for manufacturing circuit boards of high precision class. ^ EFFECT: increased reliability and moisture resistance of relief circuit boards. ^ 4 ex, 1 tbl