发明名称 |
Semiconductor device with split pad design |
摘要 |
A semiconductor device (300) includes a device body (302), a pad (304) and a signal distribution runner (306,308). The device body (302) includes a plurality of parallel cells and at least one integrated electronic component. The pad (304) is located on a surface of the device body (302) and includes a first portion (304A) and a second portion (304B) that are electrically isolated. The signal distribution runner (306,308) is electrically coupled to and extends from the first portion (304A) of the pad (304). The signal distribution runner (306,308) provides a signal to a same terminal of each of the plurality of parallel cells. The at least one integrated electronic component is electrically coupled to the second portion (304B) of the pad (304). |
申请公布号 |
EP1681719(A2) |
申请公布日期 |
2006.07.19 |
申请号 |
EP20050077999 |
申请日期 |
2005.12.27 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
CAMPBELL, ROBERT J.;HAYES, MONTY B.;FRUTH, JOHN R. |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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