发明名称 |
Circuitized substrate |
摘要 |
A circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate is also provided, as is a circuitized structure including the circuitized substrate in combination with other circuitized substrates having lesser dense thru-hole patterns. An information handling system incorporating the circuitized substrate of the invention as part thereof is also provided.
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申请公布号 |
US7078816(B2) |
申请公布日期 |
2006.07.18 |
申请号 |
US20040812890 |
申请日期 |
2004.03.31 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
JAPP ROBERT;MARKOVICH VOYA;PALOMAKI CHERYL;PAPATHOMAS KOSTAS;THOMAS DAVID L. |
分类号 |
H01L23/52;H01L21/44;H01L21/48;H01L21/50;H01L23/14;H01L23/48;H01L23/492;H01L23/498;H01L29/40;H05K1/03;H05K3/00;H05K3/46 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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