| 摘要 |
PROBLEM TO BE SOLVED: To provide a board pasting technology capable of surely securing electrical conduction between boards. SOLUTION: An OLED board 100 is rigidly combined with a wiring board 120 by using a conductive adhesive 140 having high viscosity and an internal sealing agent 141 having low viscosity. To be concrete, the conductive adhesive 140 is disposed on each electrode pad 124 exposed on the surface of the wiring board 120, and an insulating adhesive 150 for sealing peripheral parts is disposed on the peripheral parts (refer to A, B in the figure). Then, the internal sealing agent 141 in which a spacer and a desiccant are blended is disposed (refer to C in the figure) on the whole inside surface 160 of the wiring board 120 , and in addition, after the OLED board 100 is aligned with the wiring board 120, both boards are pasted by using a vacuum pasting device equipped with a vacuum pump or the like (refer to D in the figure). COPYRIGHT: (C)2006,JPO&NCIPI
|
