发明名称 METHOD FOR MANUFACTURING GRINDING PAD AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a grinding pad excellent in balance between supply and exhaust of grinding slurries. <P>SOLUTION: This grinding pad 1 contains a grinding layer which consists of multiple porous materials. In addition, the grinding surface of this grinding layer has a groove, and at least a part of the interior of the groove has a non-perforating surface. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186239(A) 申请公布日期 2006.07.13
申请号 JP20040380604 申请日期 2004.12.28
申请人 TOYO TIRE & RUBBER CO LTD 发明人 SHIMOMURA TETSUO;NAKAMORI MASAHIKO;YAMADA TAKATOSHI;KIMURA TAKESHI;OGAWA KAZUYUKI;WATANABE KIMIHIRO
分类号 H01L21/304;B24B37/20 主分类号 H01L21/304
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