| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple pattern wiring board having superior reliability and productivity for which whether the thickness of an insulation layer wherein an interconnection conductor is formed is within a predetermined range can be easily detected, and whether the impedance of the interconnection conductor is within a predetermined range can be easily and precisely detected. SOLUTION: In manufacturing the multiple pattern wiring board 9, a plurality of insulation layers are stacked to form a rectangular mother substrate 1, and a plurality of wiring board regions 5 are arranged in the matrix structure in the central portion of the mother substrate 1 and a frame-like dummy region 6 is so arranged in a peripheral region as to surround the wiring board regions 5, and then the interconnection conductors 3 are formed on the surface and inside of each wiring board region. In the four corners 6a of the mother substrate which are arranged in the dummy region, capacitance electrodes 7 opposite to each other with the insulation layer between are arranged in-between the adjacent insulation layers. COPYRIGHT: (C)2006,JPO&NCIPI
|
