| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that the number of processes increases due to the necessity for removing a film formed in a superfluous part since it is impossible to deposit a thin film with uniform thickness at the end surface of a wafer in a rectangular column shape which is a preceding stage of a semiconductor device, such as an optical waveguide. SOLUTION: In order to form a thin film at the both end surfaces of the wafer in a rectangular column shape which is made into a semiconductor device in a chip shape, a masking spacer 1 made from ceramics sandwiches each wafer in a rectangular column shape from the both sides. Ceramic particles project from the both sides 1a which come into contact with the wafer in a rectangular column shape, the surface roughness Ra is 0.3-0.9μm as a burned surface. Furthermore, it is alternately sandwiched so that the thin film formation may be made into a reflector by using the both end sides 1b as polished surfaces. While being able to prevent making it fall owing to sufficient grip effect even if it is hung in midair, the problem of soiling or damaging the thin film formation surface of the wafer in a rectangular column shape can be prevented since it is unnecessary to make it contact with a jig for carrying out the thin film formation. COPYRIGHT: (C)2006,JPO&NCIPI
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