| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for certainly obtaining a wiring board wherein the side faces of a cavity to mount a light emitting element are uniformly inclined, and are smooth. SOLUTION: The method of manufacturing the wiring board comprises: a process wherein a through hole 4 is formed in a green sheet s1 by punching; and a process wherein, using a metallic mold 10 having a flat surface 12 and a convex portion 14 having inclined surfaces with respect to the flat surface 12, and a presser member 8 having a flat surface 9 which faces the flat surface 12 of the metallic mold 10, the green sheet s1 is located above the flat surface 12, and then the presser member 8 is pressurized toward the metallic mold 10 together with the green sheet s1 so that the protruded portion of the metallic mold 10 advances into the through hole 4 of the green sheet s1. COPYRIGHT: (C)2006,JPO&NCIPI
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