发明名称 Apparatus for cutting substrate and method thereof
摘要 An apparatus for cutting a substrate includes first and second belt conveyers for conveying the substrate thereon, a scriber for scribing the substrate along a cutting-reserved line, the scriber provided between the first and second belt conveyers and being spaced apart from the first and second belt conveyers, and a substrate support for securing the substrate, the substrate support provided between the first and second belt conveyers along a scribing direction of the substrate.
申请公布号 US2006150788(A1) 申请公布日期 2006.07.13
申请号 US20050165177 申请日期 2005.06.24
申请人 LG.PHILIPS LCD CO., LTD. 发明人 KIM JUNG SIK
分类号 B26D1/00 主分类号 B26D1/00
代理机构 代理人
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