| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin film forming material suitable for the manufacture of various electronic components which can easily be formed into a film, can suppress the corrosion or deterioration due to water of the object in contact with the resin film such as a sealed content, and can achieve long term stable drive of a device; and to provide a laminate and an electronic component using it. SOLUTION: The resin film forming material for the electronic component contains (A) a resin component, (B) a solvent, and water content which is≤500 wt.ppm. The laminate has a substrate and resin films formed using that material. The electronic component comprises that laminate. COPYRIGHT: (C)2006,JPO&NCIPI
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