INDUCTOR CHIP, ITS MANUFACTURING METHOD, AND PACKAGING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thin inductor chip where a plurality of inductors are stacked. SOLUTION: The inductor chip comprises a substrate 1; inductors 3-1 to 3-4 of a plurality of layers of thin films disposed, and separated up and down on the substrate 1; a plurality of layers of interlayer insulating films 4-1 to 4-4 each for covering the inductors 3-1 to 3-4 for every layer; a plurality of plugs 6 disposed, isolated laterally, and connected respectively to the inductors 3-1 to 3-4 of each layer; and a plurality of pads 7 respectively joined with upper ends of the plurality of the plugs 6 and separately disposed on the uppermost interlayer insulating film 4-1. The inductors 3-1 to 3-4 of each layer have a spiral pattern respectively and the respective patterns are disposed and shifted transversely for every layer. The plurality of the plugs 6 penetrate the interlayer insulating films 4-1 to 4-4 and are derived onto the surface of the uppermost interlayer insulating film 4-4. COPYRIGHT: (C)2006,JPO&NCIPI