Cooling device for an electrical power semiconductor element

摘要

The device has a cooling unit (11) that is coupled with an exothermic component part and a heat pipe (12). A heat exchanger (14) is provided to supply a coolant. The heat pipe is coupled with the heat exchanger such that heat is delivered from the heat pipe directly or indirectly to the coolant. The heat exchanger has a cavity, an inlet and an outlet, and the coolant is fed to the cavity through the inlet and the outlet.