| 摘要 |
<p>An application specific heat sink assembly for dissipating heat from one or more electronic components is presented with a heat-dissipating substrate selected for one or more of its size, shape, mass, cost, thermal conductivity, or environmental resistance properties; and one or more heat-dissipating studs. Each heat-dissipating stud may be attached to the heat-dissipating substrate such that an electronic component may be attached to each heat-dissipating stud with the heat-dissipating stud providing CTE transition between the heat-dissipating substrate and the electronic component to be cooled. At least one of the heat-dissipating studs may have an upper layer with a CTE similar to the electronic component's CTE and one or more intermediate layers between the upper layer and the heat-dissipating substrate to provide CTE stepping between the CTE of the heat-dissipating substrate and the CTE of the upper layer of the heat-dissipating stud.</p> |
