发明名称 |
Kelvin contact module for a microcircuit test system |
摘要 |
A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly and in interfering relation with features of a housing that supports and aligns the contact assemblies, to apply force to the slider contacts to force them against the microcircuit terminals.
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申请公布号 |
US7074049(B2) |
申请公布日期 |
2006.07.11 |
申请号 |
US20050085782 |
申请日期 |
2005.03.21 |
申请人 |
JOHNSTECH INTERNATIONAL CORPORATION |
发明人 |
O'SULLIVAN JOHN W.;NELSON JOHN E. |
分类号 |
G01R31/26;H01R12/00;G01R1/04;G01R1/073;H01R12/50;H01R13/24;H01R33/76 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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